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KSW Microtec showcases new generation Thinlam® at ICMA EXPO

(PresseBox) (Dresden, ) KSW Microtec, one of the world's leading suppliers of RFID components and inlays for secure cards and other form factors, will be highlighting its new generation of thinnest RFID prelaminates for eGovernment, ePayment and high security applications at ICMA EXPO from May 2nd to 5th.

Along with its industry partner, AreCon, a consulting firm for smart card manufacturers and a distributor of premium semifinished smart card products, KSW Microtec will provide visitors an insight into its manufacturing expertise which brings unrivalled innovations to market, such as its latest and proven polycarbonate prelaminate, Thinlam®. This innovative family of inlays enables the implementation of a variety of additional card layers for security features without exceeding the allowed card thickness.

Thinlam® particularly targets governments, financial institutions and other highsecurity conscious institutions who constantly demand additional security features on all forms of ID cards, financial cards and documents for authentication, validation and access. In order to achieve this increasing need, multiple foil layers need to be added and large memory security microcontrollers need to be incorporated into cards and documents, while maintaining ISO standards for maximum card thickness - and Thinlam® with a thickness of 270µm is fit for purpose.

Today, given its proven capabilities, Thinlam® is used in passports, driver's licenses and ID cards as well as for epayment applications worldwide. Since the prelaminate is available in volume - and used in volume, issuers are guaranteed availability, durability and reliability.

As both sides of the card are fully opaque executable, both the chip and the antenna are visually screened. Therefore any potential deformation areas on the card are avoided when using KSWs Thinlam®. Other common restrictions regarding visual card personalization are eliminated, allowing for new features to be applied above the chip area of the card if required. Furthermore, electrical and mechanical performance, such as electrical parameter stability, is enhanced. Thinlam® is available in polycarbonate, PVC, PET or Teslin® and can also be used for transparent RFID cards due to the excellent optical appearance.

At ICMA EXPO, KSW Microtec will showcase further new and innovative products besides Thinlam®, such as its mobile phone sticker for contactless payment applications. The company's collaboration with AreCon, who represents companies such as PET foil manufacturers Agfa Materials, high security software developers for card applications Monet+ and AdvanIDe, will add value for all those attending ICMA EXPO. Both companies look forward to welcoming their partners and customers to the show and sharing their expert insights on technological and business developments and opportunities in both existing and emerging markets for advanced card security.

Visit KSW Microtec at ICMA EXPO, Marriott Camelback Inn, Scottsdale, Arizona, on Booth 3

About KSW Microtec AG

KSW Microtec AG, with its headquarters in Germany, is the world's leading supplier of RFID (Radio Frequency Identification) components for applications such as eTicketing, ePayment, Asset Management, Access Control and High Security. KSW combines successful highend wafer processing, extremely efficient assembly technology and farreaching expertise in design. KSW has earned itself a leading position on the market as one of the most efficient, and simultaneously most flexible, producers of RFID components. The globally active company was founded in 1994 and has clean room production facilities in Germany. KSW is an investment holding of the listed venture capital company Deutsche Effecten- und Wechsel-Beteiligungsgesellschaft AG headquartered in Jena. For more information see: www.ksw-microtec.de

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