New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging
DF-3520 is available in other thickness formats from 5 to 50 µm, ±5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals.
The DF-3520 film is tougher (less brittle) than most negative photo resists on the market with a glass transition temperature of 154°C (by DMA Tan Delta) and a moderate modulus of 3.25 GPa at 25°C. It is hydrophobic in nature, providing chemical and moisture resistance. DF-3520 is compatible with and can be used in contact with the EMS line of spin-coatable photoresists.
DF-3520 is the latest addition to Engineered Materials Systems’ full line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and integrated circuits.
For more information about the DF-3520 negative photo resist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.
Engineered Materials Systems
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.