Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications
These new encapsulants are designed to protect wire bonds and reduce the stresses associated with thermal cycling. These materials are engineered to withstand circuit board reliability test criteria.
The dam and fill UV cured chip encapsulants cure rapidly when exposed to intense UV light centered at 365nm. They have been developed for encapsulating small chips in smart card applications where fast processing is required. 640-35 and 640-46 are the latest additions to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.
For more information about the 640-35 and 640-46 dam and fill die encapsulants or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.
About Engineered Materials Systems
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.conductives.com.